3M Tin-Plated Copper Foil EMI Shielding Tape 1183

3M 1183 combines a tin-plated copper foil backing with an electrically conductive, pressure-sensitive acrylic adhesive. Designed for EMI shielding and grounding, it establishes an electrical path between the applied surface and the foil. The removable liner makes the tape easier to handle and die-cut for equipment and component applications.

Pros

• Conductive Adhesive: Conductive particles provide a path through the adhesive to the foil, supporting electrical contact with the substrate.
• Solderable Foil: Tin plating facilitates soldering to the backing and helps resist oxidation and corrosion.
• Easy to Convert: The removable liner supports handling and die-cutting for shaped shielding and grounding applications.

Specifications